FlexTech Seminar 2020
Flexible hybrid electronics enable automotive innovations
- Date: 8 December 2020
- Time: 13:30 – 15:55
- Venue: Sheraton Hsinchu Hotel, Taiwan
Canatu will join the FlexTech Seminar, which will be held on December 8th 2020 at Sheraton Hsinchu Hotel in Taiwan. The seminar is themed around how flexible hybrid electronics enable automotive innovations.
Samuli Kohonen will present our CNB material innovation powering 3D formed capacitive touch sensors and heaters. Our Sales Director Kerwin Yen will be onsite to address any questions you may have.
Topic: Canatu CNB material innovation enabling smart 3D touch HMIs and autonomous driving in any weather
Presenter: Samuli Kohonen, Vice President, Sales
Timing: 8 December at 15:30 – 15:55
Canatu automotive solutions range from 3D formed capacitive touch surfaces to ADAS heaters powered by our unique Carbon NanoBud material. Our technology enables capacitive touch user interfaces of any 3D shape. Furthermore, you can add 3D touch sensors on almost any non-conductive material. Our film-based heaters keep LiDAR and camera sensors free from moisture, ice and snow build-ups enabling safe and autonomous driving in any weather.
Canatu’s Carbon NanoBud material innovation delivers value across industries. Our automotive solutions, ranging from 3D formed capacitive touch switches to ADAS heaters, enable design freedom and intuitive user experiences; and help ensure safe and autonomous driving in any weather. Our semiconductor solutions enhance efficiency and precision with positive impact on everyday life. Canatu is headquartered in Finland, with sales locations in Europe, US, Japan, China and Taiwan.
About FlexTech Seminar
The flexible hybrid electronics (FHE) combine the flexibility, lightweight, thinness and of large-area electronics with the processing power of semiconductors to open a broad range of new applications across different end-use applications.
Automotive segment is one of the most promising markets. Whether it is sensors, OLED displays and lighting, in-mold electronics, printed heaters or other applications. With the rapid growth of FHE, it is expected the market value of FHE will reach from USD 95.28 million to USD231.12 million by 2025.
As vehicles continue to get smarter and more electronically sophisticated, new challenges are introduced throughout the production process. Factors in consumer preference considerations, safety requirements and the need for skilled design is further driving the automotive market.
This seminar focuses on how flexible hybrid electronics are applied in automotive to foster the industry development. The seminar program features insightful presentations from OEM, Tier 1 supplier, PCB and material companies.